Electronics PCB Board Assembly Multilayer MP3 Subwoofer PCB Manufacturer

• Type: Rigid Circuit Board
• Dielectric: FR-4
• Material: Fiberglass Epoxy
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: PCB#0014
• Flame Retardant Properties: V0
• Mechanical Rigid: Rigid
• Processing Technology: Electrolytic Foil
• Base Material: Copper
• Insulation Materials: Organic Resin
• Model: FR-4
• Brand: OEM
• PCB Max Size: 400*310mm
• PCB Min Size: 20*10mm
• PCB Thickness: 0.4~1.5mm
• Impedance: 50~120 Ohm
• Hole Min Diameter: 0.1mm
• Transport Package: Polybag, Bubble Bag, Box
• Specification: Standard
• Trademark: OEM
• Origin: China
• HS Code: 8534001000

Product Description

PCB / FPC

Kenling Electronic has many years experience on PCB & FPC industry. With our reliable partners, we can offer 2 to 12 layers on PCB, and 1 to 6 layers on FPC. We offer fast turn PCB samplings as fast as 72 hours. Our products are widely used on computer markets, industries markets, and health & medic markets.

Rigid Board Capability

 

· Layers count:	2-12
· Base Material:	FR4 0.2mm~3.2mm Aluminium 0.8~2.0mm
· Min Line width/spacing(mil):	3.0/3.0
· Min Hole size (mil):	8
· Hole Dia. Tolerance:	NPTH±0.05mm PTH±0.076mm
· Surface Treatment:	Lead-free HASL Immersion gold Gold plating OSP
· Outline Tolerance:	CNC±0.1mm Punch±0.13mm

Flexible Board Capability

· Layers count:	1-6
· Base Material:	Polyimide 12.5um,25um,50um
· Min Line width/spacing(mil):	3.0/3.0
· Min Hole size (mil):	8
· Hole Dia. Tolerance:	NPTH±0.05mm PTH±0.076mm
· Surface Treatment:	Immersion Tin / Gold Gold / Tin plating OSP
· Outline Tolerance:	CNC±0.075mm Punch±0.1mm